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Investigation of residual stresses and modeling of tensile deformation in wire-arc additive manufactured 6061 aluminum alloy: Diffraction and elastoplastic self-consistent model

Investigation residual stresses modeling tensile is a M.Tech project topic for Mechanical Engineering. Explore the IEEE-style abstract, reference…

Investigation residual stresses modeling tensile is a M.Tech project topic for Mechanical Engineering. It gives students a clear starting point for research, implementation planning, and documentation.

Investigation residual stresses modeling tensile Project Details

Abstract

This project studies how 6061 aluminum alloy parts made with Wire Arc Additive Manufacturing (WAAM) behave mechanically at different scales and how residual stresses are distributed inside them. We used surface‑level X‑ray diffraction and bulk‑level neutron diffraction to map residual stresses across the printed walls. The measurements show a clear gradient: stresses are low near the surface but become much larger inside the bulk. We performed uniaxial tensile tests in several directions to see how the WAAM material’s mechanical properties differ from those of standard T6‑tempered alloy. To explain the observed behavior, we built an elasto‑plastic self‑consistent (EPSC) model that includes the alloy’s microstructure, grain shape, and crystallographic texture. We

checked the model against strain pole figures taken from in‑situ X‑ray diffraction during uniaxial tension. Overall, the work offers a complete framework for modeling deformation and predicting internal stress states in additively manufactured high‑strength aluminum alloys. It can help engineers assess structural integrity, improve the WAAM process, and design better microstructures.

Reference Paper Investigation of residual stresses and modeling of tensile deformation in wire-arc additive manufactured 6061 aluminum alloy: Diffraction and elastoplastic self-consistent model
Domain Mechanical Engineering
Sub-Domain Design & Manufacturing / Additive Manufacturing
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