A wireless subdural-contained brain-computer interface with 65,536 electrodes and 1,024 channels.

High‑density brain‑computer interfaces need architectures that can handle huge electrode arrays while staying safe in temperature and fitting within wireless bandwidth limits. This work looks at a wireless, subdural brain‑computer interface that uses a 65,536‑electrode grid. The grid is multiplexed down to 1,024 active recording channels. The approach tackles three main problems: the tight space under the dura, the amount of power the device can safely dissipate, and the need to send large amounts of data wirelessly. Computer models test active‑matrix multiplexing methods that move signals from the dense electrode layout to on‑chip analog‑to‑digital converters. Signal‑processing models examine how the design improves spatial resolution, boosts signal‑to‑noise ratio, and compresses data

enough for real‑time wireless transmission. Thermal simulations check that the implant’s electronics stay within safe body temperature limits during continuous use. A development framework guides the simulation of neural‑decoding performance, the calculation of wireless link budgets, and the selection of the best recording channels. Together, these models give a thorough assessment of high‑density subdural interfaces and lay the groundwork for future implantable neural prosthetics and high‑bandwidth brain‑machine communication systems.

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