Mathematical Formulation with Finite Element Simulation for Thermo-Mechanical Stress Analysis in Power Electronic Modules

The project develops a mathematical model and runs transient finite‑element analysis (FEA) to see how heat and mechanical stress spread in multilayer power‑electronic modules. Modern power converters dump a lot of heat and experience repeated temperature changes, which create strong local stresses. Those stresses lower reliability and can cause devices to fail early. To study this, we built a three‑dimensional transient finite‑element model that solves the coupled equations for heat conduction and linear thermoelasticity. The simulation checks temperature fields and stress patterns while the power dissipation varies from 20 W to 100 W, with the ambient temperature set at 25 °C. The model records key values such as the highest

junction temperature and the maximum von Mises stress at the module interfaces. We verified the results by performing mesh‑convergence tests and comparing them with data from the literature, ensuring the predictions are accurate. This approach gives researchers and designers a clear, repeatable way to assess reliability and thermal management in high‑power semiconductor packages.

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