Investigation of Si3N4 Nanoparticles Effect on the Electrical Properties of Polyimide for Power Electronics Applications

This project studies how nanostructured polyimide (PI) films behave electrically when they contain silicon nitride (Si₃N₄) nanoparticles. Adding Si₃N₄ is meant to raise the film’s thermal conductivity and its ability to withstand high temperatures, while keeping its basic electrical insulation unchanged. We look at how different amounts of nanoparticles (by weight) affect the dielectric properties and how charge moves through the nanocomposite films. The experiments use broadband dielectric spectroscopy (BDS) to measure complex permittivity, conductivity, and dielectric loss over a wide range of frequencies and temperatures. We also use thermally stimulated depolarization currents (TSDC) to study charge trapping and release, as well as dipole relaxation inside the material. The work

gives a clear research plan and practical help for modeling and analyzing the dielectric response of polymer nanocomposites. The results should help improve insulation materials for next‑generation, high‑power‑density wide‑bandgap semiconductor modules that operate under very high thermal stress.

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